A chemical element having an atomic weight of 106.4, atomic number of 46, and the symbol Pd.
It is a white, ductile metal resembling platinum, and following it in abundance and importance
of applications.
It is used in dentistry in the form of gold, silver, and copper alloys.
Traini T, Murmura G, Di Lullo N, Caputi S.
Adherence of investment to Au-Pd-Ag alloy using a vacuum-argon pressure casting machine. (Dent Mater. 2003 Dec;19(8):732-8.)
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Guo WH, Brantley WA, Clark WA, Xiao JZ, Papazoglou E.
Transmission electron microscopic studies of deformed high-palladium dental alloys. (Dent Mater. 2003 Jun;19(4):334-40.)
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Colon P, Pradelle-Plasse N, Galland J.
Evaluation of the long-term corrosion behavior of dental amalgams: influence of palladium addition and particle morphology. (Dent Mater. 2003 May;19(3):232-9.)
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Guo WH, Brantley WA, Clark WA, Monaghan P, Mills MJ.
Transmission electron microscopic investigation of a Pd-Ag-In-Sn dental alloy. (Biomaterials. 2003 May;24(10):1705-12.)
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Chang JC, Koh SH, Powers JM, Duong JH.
Tensile bond strengths of composites to a gold-palladium alloy after thermal cycling. (J Prosthet Dent. 2002 Mar;87(3):271-6.)
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Shimizu T, Goto S, Ogura H.
Effects of Sn, Ga, and In additives on properties of Ag-Pd-Au-Cu alloy for ultra-low fusing ceramics. (Dent Mater J. 2001 Dec;20(4):286-304.)
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Sun D, Monaghan P, Brantley WA, Johnston WM.
Potentiodynamic polarization study of the in vitro corrosion behavior of 3 high-palladium alloys and a gold-palladium alloy in 5 media. (J Prosthet Dent. 2002 Jan;87(1):86-93.)
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Goto S, Miyagawa Y, Ogura H.
Development of Ag-Pd-Au-Cu alloy for multiple dental applications. Part 1. Effects of Pd and Cu contents, and addition of Ga or Sn on physical properties and bond with ultra-low fusing ceramic. (Dent Mater J. 2000 Sep;19(3):294-306.)
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Goto S, Nakai A, Miyagawa Y, Ogura H.
Development of Ag-Pd-Au-Cu alloys for multiple dental applications. Part 2. Mechanical properties of experimental Ag-Pd-Au-Cu alloys containing Sn or Ga for ceramic-metal restorations. (Dent Mater J. 2001 Jun;20(2):135-47.)
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